Summit Interconnect Announces Greg Halvorson as COO and Mike Graves as Santa Clara VP/GM

Organizational Announcement

Summit Interconnect, a leading North American manufacturer of complex printed circuit products, recently announced changes in its executive management organization.

Greg Halvorson has been appointed as Senior Vice President and Chief Operating Officer for the company.  In this new role, Greg will oversee the manufacturing operations of all Summit locations, as well as supply chain and technology development across the company.  Greg has extensive executive experience in the PCB industry, where he was instrumental in building both Streamline Circuits and Dynamic Circuits/DDI into premier, best-in-class companies.  His prior experience includes management roles at Pacific Circuits and Advanced Circuits (ACI).

Mike Graves has been appointed as Vice President and General Manager of Summit’s Santa Clara division.  This division of Summit is a market leader in advanced technology, quick turn manufacturing.  Mike is well suited for this role with over 30 years of management experience including operations management of Streamline Circuits, Prototron, and Pacific Circuits.

About Summit

Summit Interconnect, Inc. is a leading manufacturer of advanced technology printed circuit boards.  Manufacturing services include quick-turn, prototype and production through our advanced technology facilities located in California.  For more information go to www.summit-pcb.com

Contact: Clay Swain, Vice President Sales & Marketing

clay.swain@summit-pcb.com